What is BGA?
A BGA or ball grid array is a package of surface mount technology (where SMD electronic components are actually "mounted" or attached to the surface of an SMT printed circuit board). The BGA package has no leads or pins. The ball grid array is named because it is basically an array of metal alloy balls arranged in a grid. These BGA balls are usually tin/lead (Sn / Pb 63/37) or tin/lead/silver (Sn / Pb / Ag).
BGA has many advantages over SMD or surface mount devices:
PCBs or printed circuit boards in today's electronic devices and gadgets are densely packed with electronic components. The size of the board will increase as the number of electronic components increases. In order to squeeze the size of the PCB, SMD and BGA packages are used because SMD and BGA are smaller and slimmer in size, and occupy very little space on the PCB. BGA components provide a better solution for many boards, but care must be needed when soldering BGA components to ensure that the BGA soldering process is correct and reliable.
The BGA also has the following advantages:
Improved PCB design due to lower track density.
The BGA package is robust.
Reduce thermal resistance.
Improved high-speed performance and connectivity.
Related article:
A BGA or ball grid array is a package of surface mount technology (where SMD electronic components are actually "mounted" or attached to the surface of an SMT printed circuit board). The BGA package has no leads or pins. The ball grid array is named because it is basically an array of metal alloy balls arranged in a grid. These BGA balls are usually tin/lead (Sn / Pb 63/37) or tin/lead/silver (Sn / Pb / Ag).
BGA has many advantages over SMD or surface mount devices:
PCBs or printed circuit boards in today's electronic devices and gadgets are densely packed with electronic components. The size of the board will increase as the number of electronic components increases. In order to squeeze the size of the PCB, SMD and BGA packages are used because SMD and BGA are smaller and slimmer in size, and occupy very little space on the PCB. BGA components provide a better solution for many boards, but care must be needed when soldering BGA components to ensure that the BGA soldering process is correct and reliable.
The BGA also has the following advantages:
Improved PCB design due to lower track density.
The BGA package is robust.
Reduce thermal resistance.
Improved high-speed performance and connectivity.
Related article:
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