How to decide when choosing AOI and X-ray inspection method

Automated Optical Inspection (AOI) is a tool in circuit board assembly to efficiently and accurately detect production errors before boards leave the facility. AOI uses cameras and image processing software to identify assembly errors such as missing or misplaced components, soldering short circuits and disconnected components. With more complex boards and larger production quantities, this tool improves error detection over visual inspection. AOI machines have seen widespread adoption as surface mount components have miniaturized and board production aims to be more efficient.

X-ray inspection technology, usually referred to as Automated X-ray inspection (AXI), is a technology used to inspect the hidden features of target objects or products with X-rays as its source. Nowadays, X-ray inspection is widely used in lots of applications such as medical, industrial control, and aerospace. As for PCB inspection, X-ray is massively used in the process of PCB assembly in order to test the quality of PCBs, which is one of the most important steps for quality-oriented PCB manufacturers.

AOI and X-Ray are two entirely different types of inspection. AOI is best used for detecting the presence, correct part, polarity, skew, and various solder defects. X-Ray is typically used for inspection of wiring assemblies, semiconductor packaging, and BGA solder defects that are not visible to the naked eye.

If your company places a large number of BGA parts and provides BGA rework, it is important to have a suitable X-ray system to assist with this process. If you are seeing more minor defects on a completed board, the AOI system can save you time and money. I think these two systems are necessary for modern assembly plants, but if you have to choose between one or the other, you will need to ask yourself a series of questions about the current process to determine the system that will add the most value.

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